Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /
Guardat en:
| Autor corporatiu: | |
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| Altres autors: | |
| Format: | Actes de congresos Llibre |
| Idioma: | anglès |
| Publicat: |
Nueva York, EUA :
American Society of Mechanical Engineers,
2001, c2001
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| Matèries: | |
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