Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /
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| Autor kompanije: | |
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| Daljnji autori: | |
| Format: | Izvještaj sastanka Knjiga |
| Jezik: | engleski |
| Izdano: |
Nueva York, EUA :
American Society of Mechanical Engineers,
2001, c2001
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| Teme: | |
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Slični predmeti: Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /
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