Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /
Guardado en:
| Autor corporativo: | |
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| Otros autores: | |
| Formato: | Procedimiento de la conferencia Libro |
| Idioma: | Inglés |
| Publicado: |
Nueva York, EUA :
American Society of Mechanical Engineers,
2001, c2001
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| Temas: | |
| Etiquetas: |
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