Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /
Saved in:
| Corporate Author: | |
|---|---|
| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Nueva York, EUA :
American Society of Mechanical Engineers,
2001, c2001
|
| Subjects: | |
| Tags: |
No Tags, Be the first to tag this record!
|
| Physical Description: | VII, 305 p. |
|---|---|
| ISBN: | 0-7918-3565-0 |