Packaging, Reliability and Manufacturing Issues Associated with Electronic and Photonic Products /

Saved in:
Bibliographic Details
Corporate Author: American Society of Mechanical Engineers International Mechanical Engineering Congress and Exposition ( Nueva York, EUA)
Other Authors: Ume, I. Charles (edición) (edición)
Format: Conference Proceeding Book
Language:English
Published: Nueva York, EUA : American Society of Mechanical Engineers, 2001, c2001
Subjects:
Tags: Add Tag
No Tags, Be the first to tag this record!
Description
Physical Description:VII, 305 p.
ISBN:0-7918-3565-0