Chip Scale Package, CSP : Design, Materials, Processes, and Aplications /
Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs.
I tiakina i:
| Kaituhi matua: | |
|---|---|
| Ētahi atu kaituhi: | |
| Hōputu: | Pukapuka |
| Reo: | Ingarihi |
| I whakaputaina: |
Nueva York, EUA :
McGraw-Hill,
1999, c1999
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| Ngā marau: | |
| Ngā Tūtohu: |
Kāore He Tūtohu, Me noho koe te mea tuatahi ki te tūtohu i tēnei pūkete!
|
Me noho koe te mea tuatahi ki te waiho tākupu!