Chip Scale Package, CSP : Design, Materials, Processes, and Aplications /
Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs.
Na minha lista:
| Autor principal: | |
|---|---|
| Outros Autores: | |
| Formato: | Livro |
| Idioma: | inglês |
| Publicado em: |
Nueva York, EUA :
McGraw-Hill,
1999, c1999
|
| Assuntos: | |
| Tags: |
Sem tags, seja o primeiro a adicionar uma tag!
|
MARC
| LEADER | 00000nam^a2200000^a^4500 | ||
|---|---|---|---|
| 001 | 000105251 | ||
| 005 | 20250521000000.0 | ||
| 009 | 20260310093455.06 | ||
| 020 | |a 0-07-038304-9 | ||
| 037 | |a Acervo ITESO - Biblioteca | ||
| 041 | |a ING | ||
| 082 | |a 621. 3815 |b LAU | ||
| 100 | |a Lau, John H. |e (autor) | ||
| 245 | 1 | 0 | |a Chip Scale Package, CSP : |b Design, Materials, Processes, and Aplications / |c J.H. Lau, S.W. Ricky Lee. |
| 264 | 4 | |a Nueva York, EUA : |b McGraw-Hill, |c 1999, c1999 | |
| 300 | |a 564 p. | ||
| 336 | |a texto |b txt |2 rdacontenido | ||
| 337 | |a sin mediación |b n |2 rdamedio | ||
| 338 | |a volumen |b nc |2 rdasoporte | ||
| 520 | |a Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs. | ||
| 649 | |a XX | ||
| 650 | |a Circuitos Integrados | ||
| 650 | |a Circuitos Electrónicos | ||
| 650 | |a Microelectrónica (Empaquetado) - |x Tema Principal | ||
| 650 | |a Microelectrónica | ||
| 650 | |a Ingeniería Electrónica | ||
| 700 | |a Lee, Shi-Wei Ricky |e (autor) | ||
| 910 | |a Fondo General | ||
| 920 | |a Impresos - Libros | ||
| 930 | |a Colección General | ||
| 905 | |a 101 | ||
| 901 | |a 0500039418 |b IT1 |c ACC |u 20250521 | ||
| 902 | |a https://opac.biblio.iteso.mx/vufind/Record/000105251 | ||