Chip Scale Package, CSP : Design, Materials, Processes, and Aplications /
Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs.
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| Format: | Bog |
| Sprog: | engelsk |
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Nueva York, EUA :
McGraw-Hill,
1999, c1999
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