Chip Scale Package, CSP : Design, Materials, Processes, and Aplications /
Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs.
Saved in:
| Main Author: | |
|---|---|
| Other Authors: | |
| Format: | Book |
| Language: | English |
| Published: |
Nueva York, EUA :
McGraw-Hill,
1999, c1999
|
| Subjects: | |
| Tags: |
No Tags, Be the first to tag this record!
|
| Summary: | Contents: Flip chip and wire bond for CSP; Customized leadframe based CSPs; CSP with flexible substate; CSP with rigid substrate; Wafer-level redistribution CSPs. |
|---|---|
| Physical Description: | 564 p. |
| ISBN: | 0-07-038304-9 |